Advanced Flip Chip Packaging -
-25% koodilla BOOKS
Toimitus 15-21 arkipäivässä
30 päivän palautusoikeus
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance ... Täydellinen kuvaus
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Kuvaus
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Lisätietoja
| Julkaisija | Springer New York |
|---|---|
| Julkaisuvuosi | 2016 |
| Kannen tyyppi | Pehmeäkantinen |
| EAN | 9781489979339 |