Area Array Package Design - Ken Gilleo
-25% koodilla BOOKS
Toimitus 22-28 arkipäivässä
30 päivän palautusoikeus
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Kuvaus
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Lisätietoja
| Kirjoittaja | Ken Gilleo |
|---|---|
| Julkaisija | McGraw-Hill Education LLC (Professional Pod) |
| Julkaisuvuosi | 2003 |
| Kannen tyyppi | Pehmeäkantinen |
| EAN | 9780071737739 |