Area Array Packaging Processes - Ken Gilleo
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Toimitus 22-28 arkipäivässä
30 päivän palautusoikeus
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Kuvaus
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Lisätietoja
| Kirjoittaja | Ken Gilleo |
|---|---|
| Julkaisija | McGraw-Hill Education LLC (Professional Pod) |
| Julkaisuvuosi | 2003 |
| Kannen tyyppi | Pehmeäkantinen |
| EAN | 9780071738019 |