Materials for Advanced Packaging - Daniel Lu,C.P. Wong
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established te ... Täydellinen kuvaus
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Kuvaus
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Lisätietoja
| Kirjoittaja | Daniel Lu, C.P. Wong |
|---|---|
| Julkaisija | Springer US |
| Julkaisuvuosi | 2008 |
| Kannen tyyppi | Kovakantinen |
| EAN | 9780387782188 |