Reliability Technology for Integrated Circuit Packaging - Si Chen,Bin Zhou,Yunfei En
-35% koodilla BOOKS
Toimitus 17-23 arkipäivässä
30 päivän palautusoikeus
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing ... Täydellinen kuvaus
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Kuvaus
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
Lisätietoja
| Kirjoittaja | Si Chen, Bin Zhou, Yunfei En |
|---|---|
| Julkaisija | Springer-Verlag GmbH |
| Julkaisuvuosi | 2026 |
| Kannen tyyppi | Kovakantinen |
| EAN | 9789819538843 |