Sic Power Module Design: Performance, Robustness and Reliability -
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Toimitus 10-16 arkipäivässä
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Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
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Kuvaus
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
Lisätietoja
| Julkaisija | Institution of Engineering & Technology |
|---|---|
| Series | Energy Engineering |
| Julkaisuvuosi | 2022 |
| Kannen tyyppi | Kovakantinen |
| EAN | 9781785619076 |