Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Shuye Zhang,Guoli Sun
-35% koodilla BOOKS
Toimitus 10-16 arkipäivässä
30 päivän palautusoikeus
There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
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Kuvaus
There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
Lisätietoja
| Kirjoittaja | Shuye Zhang, Guoli Sun |
|---|---|
| Julkaisija | Institution of Engineering & Technology |
| Julkaisuvuosi | 2025 |
| Kannen tyyppi | Kovakantinen |
| EAN | 9781837241408 |