Wafer Level 3-D ICs Process Technology -
-25% koodilla BOOKS
Toimitus 17-23 arkipäivässä
30 päivän palautusoikeus
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry¿s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devic ... Täydellinen kuvaus
Saatat myös pitää
TOP
INCOSE Systems Engineering Handbook
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
If Anyone Builds It, Everyone Dies: The Case Against Superintelligent AI
Eliezer Yudkowsky, Nate Soares
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Open Circuits: The Inner Beauty of Electronic Components
Eric Schlaepfer, Windell Oskay
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Get started with MicroPython on Raspberry Pi Pico: The Official Raspberry Pi Pico Guide
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
We Are Not Machines: The Fight for the Future of Work
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Practical Electronics for Inventors
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Nucleo Boards Programming with the STM32CubeIDE: Hands-on in more than 50 projects
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Fundamentals of Aerodynamics ISE
Christopher Cadou, John D. Anderson
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Black Holes: The Key to Understanding the Universe
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Flowers For Algernon: A Modern Literary Classic
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Human Compatible: Artificial Intelligence and the Problem of Control
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
How To Read Water: Clues & Patterns from Puddles to the Sea
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Foundations of Flavor: The Noma Guide to Fermentation: Including Step-By-Step Information on Making and Cooking with: Koji, Kombuchas, Shoyus, Misos, Vinegars, Garums, Lacto-Ferments and black Fruits Vegetables
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Make: Electronics: Learning by Discovery: A hands-on primer for the new electronics enthusiast
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Data-Driven Science and Engineering: Machine Learning, Dynamical Systems, and Control
Steven L. Brunton, J. Nathan Kutz
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
The Idea Factory: Bell Labs and the Great Age of American Innovation
-25% koodilla BOOKS
Toimittajalla varastossa
TOP
Foundation Design and Construction
-25% koodilla BOOKS
Toimittajalla varastossa
Kuvaus
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry¿s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ?ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today¿s trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ?ows, and functional diversi?cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren¿t vertically stacked strata endemic to the semiconductor industry? The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
Lisätietoja
| Julkaisija | Springer US |
|---|---|
| Series | Integrated Circuits and Systems |
| Julkaisuvuosi | 2008 |
| Kannen tyyppi | Kovakantinen |
| EAN | 9780387765327 |