Wafer Level 3-D ICS Process Technology -
-35% koodilla BOOKS
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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology ... Täydellinen kuvaus
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Kuvaus
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Lisätietoja
| Julkaisija | Springer Us |
|---|---|
| Julkaisuvuosi | 2010 |
| Kannen tyyppi | Pehmeäkantinen |
| EAN | 9781441945624 |